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Andrew Zonenberg

This time I added witness solder on Kapton tape pads on both the FPGA package and the fixture. They melted quite a bit later than the adjacent board did.

Gave it 45 sec after *they* melted and hopefully it's good. I don't want to put more thermal cycles on this chip than I have to. I've already violated the absolute max ratings enough :)

FPGA in reballing fixture in oven
Jan 06, 2024, 01:40 AM·Public·Mastodon for Android
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