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Andrew Zonenberg

The thermal pad I'm using is only 15mm square, not enough to cover the whole package, but it comfortably covers the die. Not like the bypass caps or substrate need cooling anyway.

The board after heatsink installation
Blue thermal pad over FPGA die
Flip chip BGA package with bare die visible
Feb 26, 2024, 07:49 PM·Public·Mastodon for Android
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