Which brings us to the present: back side of the board had a handful of bad joints post reflow, all of which were easy to rework with an iron.
Front side has been pasted, paste quality looks excellent (nothing to rework) on initial at-a-glance inspection. High res microscope scan of front paste in progress.
Gonna go do some other stuff and come back to it in an hour. If I don't see any issues in the paste I'll start stuffing the board.
Doing all of this metrology mid-process is definitely not the fastest way to build a board but it's really nice to be able to go back to photos of what an area looked like pre reflow and root-cause a defect. So I think I'll keep doing it until I have the kinks worked out.