Sending the LATENTRED line card designs off to fab for a quote!
Final gerber review to look for anything else funky. Saw two minor silkscreen issues and fixed them, everything else looked good.
Layer 2 ground plane, including various cutouts under connector pads and BGA lands for impedance matching
@azonenberg
Is that the Godot logo?
@FritzAdalis Lol. Does kinda look like it, doesn't it.
Quick, somebody start designing chips where the BGA breakout spells your company logo or something.
@azonenberg@ioc.exchange @FritzAdalis@infosec.exchange already done by raspberry pi
@ignaloidas @FritzAdalis Wuuuut which chip is this?
@azonenberg@ioc.exchange @FritzAdalis@infosec.exchange Some RP zero one, it's broadcom silicon but their packaging with dram on top
@azonenberg @ignaloidas @FritzAdalis from memory this was on the Pi5 where they glued a DRAM die on top of the CPU
@jpm@aus.social @azonenberg@ioc.exchange @FritzAdalis@infosec.exchange no, pi5 is entirely different, it has separate DRAM chip in a separate package
it's Pi Zero 2W